Application of Kitronyx's Pressure Distribution Measurement System for Semiconductor Wafer Bonding Process.
Purpose
The Importance of Void Elimination and Alignment Precision in Wafer Bonding
In the semiconductor wafer bonding process, eliminating voids during bonding and maintaining alignment while applying uniform pressure are critical for ensuring product quality. Failure to apply even pressure across the bonding surface can result in weakened bonding strength or misalignment, leading to defects. To ensure process stability and quality, it is essential to monitor and optimize the pressure distribution of bonding equipment.
PressureScan II offers an exceptional solution for optimizing the bonding process and automating equipment quality inspections. By utilizing PressureScan II during the equipment setup stage, the pressure distribution can be visualized, and quantitative data can be obtained. This enhances process reliability and establishes an effective quality control framework, making it an indispensable tool for the semiconductor wafer bonding industry.
Results
The measurement results were obtained by placing the wafer beneath the sensor and applying pressure in low, medium, and high ranges. When pressure is applied using the bonding equipment, the results indicate a tendency for pressure to concentrate around the central area. Applying pressure within the medium-to-high range appears to distribute the pressure more evenly across the outer regions.
The results are presented using a Red Map to provide a familiar visual representation for customers accustomed to using pressure measurement films. In ForceLAB2, the color map used to visualize pressure distribution can be customized according to user preferences. Supported options include Heat Map, Gray Map, Red Map, or user-defined RGB values.
Among these, the Red Map is particularly useful as a visual indicator for comparing PressureScan II results with traditional pressure measurement film patterns. Customers who previously used pressure measurement films for testing can acquire data from the same equipment using PressureScan II and establish pass/fail criteria by comparing the shapes between the two methods.
Expected Benefits and Applications
PressureScan II: A Solution to Maximize Quality Inspection Efficiency Without Interrupting Processes
Pressure measurement films are heavily influenced by subjective interpretation during visual inspection. Additionally, separate scanning is required for data analysis, making the process cumbersome.
PressureScan II overcomes these limitations by enabling real-time data acquisition without interrupting processes after initial setup. As an industry-specific solution, it supports a data-driven environment for process and quality improvement with the following features:
•Real-time data storage and replay functionality
•Pass/Fail judgment capabilities
By continuously collecting and analyzing data without stopping processes, PressureScan II standardizes and automates quality inspection workflows. This enables real-time quality management, productivity improvement, and immediate issue response. Such capabilities lay the foundation for implementing smart factory processes.
※ The features and contents described in this document are subject to change without notice for performance improvement.
The images included are for illustrative purposes and may differ from actual results.
If you have any other inquiries, please leave a message through the URLs below, and we will respond promptly.
For product inquiries: https://www.kitronyx.com/contact
For technical support inquiries: https://www.kitronyx.com/support_request
Application of Kitronyx's Pressure Distribution Measurement System for Semiconductor Wafer Bonding Process.
Purpose
The Importance of Void Elimination and Alignment Precision in Wafer Bonding
In the semiconductor wafer bonding process, eliminating voids during bonding and maintaining alignment while applying uniform pressure are critical for ensuring product quality. Failure to apply even pressure across the bonding surface can result in weakened bonding strength or misalignment, leading to defects. To ensure process stability and quality, it is essential to monitor and optimize the pressure distribution of bonding equipment.
PressureScan II offers an exceptional solution for optimizing the bonding process and automating equipment quality inspections. By utilizing PressureScan II during the equipment setup stage, the pressure distribution can be visualized, and quantitative data can be obtained. This enhances process reliability and establishes an effective quality control framework, making it an indispensable tool for the semiconductor wafer bonding industry.
Results
The measurement results were obtained by placing the wafer beneath the sensor and applying pressure in low, medium, and high ranges. When pressure is applied using the bonding equipment, the results indicate a tendency for pressure to concentrate around the central area. Applying pressure within the medium-to-high range appears to distribute the pressure more evenly across the outer regions.
The results are presented using a Red Map to provide a familiar visual representation for customers accustomed to using pressure measurement films. In ForceLAB2, the color map used to visualize pressure distribution can be customized according to user preferences. Supported options include Heat Map, Gray Map, Red Map, or user-defined RGB values.
Among these, the Red Map is particularly useful as a visual indicator for comparing PressureScan II results with traditional pressure measurement film patterns. Customers who previously used pressure measurement films for testing can acquire data from the same equipment using PressureScan II and establish pass/fail criteria by comparing the shapes between the two methods.
Expected Benefits and Applications
PressureScan II: A Solution to Maximize Quality Inspection Efficiency Without Interrupting Processes
Pressure measurement films are heavily influenced by subjective interpretation during visual inspection. Additionally, separate scanning is required for data analysis, making the process cumbersome.
PressureScan II overcomes these limitations by enabling real-time data acquisition without interrupting processes after initial setup. As an industry-specific solution, it supports a data-driven environment for process and quality improvement with the following features:
•Real-time data storage and replay functionality
•Pass/Fail judgment capabilities
By continuously collecting and analyzing data without stopping processes, PressureScan II standardizes and automates quality inspection workflows. This enables real-time quality management, productivity improvement, and immediate issue response. Such capabilities lay the foundation for implementing smart factory processes.
※ The features and contents described in this document are subject to change without notice for performance improvement.
The images included are for illustrative purposes and may differ from actual results.
If you have any other inquiries, please leave a message through the URLs below, and we will respond promptly.
For product inquiries: https://www.kitronyx.com/contact
For technical support inquiries: https://www.kitronyx.com/support_request